ISI adapters allow the use of a newer or more available IC without redesigning the existing motherboard. ISI Adapter conversions include:
BGA to Micro Leadframe
BGA to Multi-Device Socketed
Quad Flat Pack to Micro BGA
TSOP to BGA
Intel/AMD microprocessor socket adapters
PGA to BGA
ISI is the recognized industry leader and the world's largest volume manufacturer
of adapter products that convert single or multiple components to almost any IC footprint.
ISI designs approximately 150 new adapters each year to help our customers
through semiconductor shortages or outages.
ISI has developed a broad line of module level interconnect to target all semiconductor packaging types:
BGA / LGA
QFP / PLCC / SOIC / TSOP
PGA / Micro PGA / DIP
Our customers include leading electronics manufactures such as: AGILENT, BAE, BOEING, CISCO, GENERAL DYNAMIC, HARRIS, HONEYWELLHP, IBM, LOCKHEED, LUCENT, MOTOROLA, NORTEL, RAYTHEON, ROCKWELL, SUN MICROSYSTEMS and TELLABS
Advantages
ISI can supply the adapter only, or provide complete turn-key assembly:
- purchase the required components
- solder the components to the top of the adapter
- test the completed assembly
ISI's automated manufacturing process provides a low cost adapter solution for high volume applications.. We have supported many programs with volumes in the 100,000's and millions.
ISI adapters can be assembled to the host motherboard with standard IC placement equipment.
Power and ground supply planes and decoupling capacitors can be added as needed.
ISI has experience with fine pitch components:
- Adapters are available for QFPs with 0.4mm lead spacing,
- BGAs with 0.5mm lead spacing
- Passive devices in 0201 body size.
ISI adapters are packed in tape and reel or JEDEC trays as required
Concept to prototype in 2 weeks, volume production in 4 weeks.
ISI continually adds to its catalog of chip-specific adapters, and will work with you to produce any adapter that we do not already supply.
