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Cost Reduction Modules

Applications
Semiconductor technology is constantly improving. 
Higher levels of IC integration require higher density packages.
- Package pin counts are increasing
- Package pitch is decreasing
High density packages require high density PCBs
- Fine line and space
- High layer count
- Blind and buried vias
- Laser drilled microvias
High density PCBs can be a significant cost factor
- Reduced supplier base
- Lower yield 2x - 6x cost increase
In many cases, only a small percentage of the area on the motherboard
requires high density PCB rules:
- Microprocessor + Memory
- ASIC + Memory
- FPGA + Memory

microprocessor and memory moduleMicroprocessor + Memory

microprocessor modulesMicroprocessor Module
Solutions
Alternative to increasing layer count of the motherboardCost Reduction Modules (CRMs) from ISI Isolate high density circuitry to the few square inches it is required, rather than the entire motherboard ISI has the know-how, the enabling technologies, and the products to help you implement a Cost Reduction Module Program:
Complete Module / PCB design
Unique interconnect solutions for socketing or soldering modules to motherboard
Integrated electronics assembly of bare die, packaged die, and interconnect

module on board
miscrocrocessor module 2

ISI was selected by IBM and Motorola to manufacture the microprocessor module forApple G3 computers. ISI manufactured over 4 million module during the project, and at the peak we were shipping 2.5 million pins per day




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