Interconnect Systems, Inc.
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Advanced SMT


State-of-the-Art SMT Assembly Line


Solder Stencil Printers with 2.5 D paste inspection
SMT Chipshooter with 0201 placement capacity
SMT Pick & Place equipment with 3" square bottom vision capability
8 + 2 Zone Convection Reflow Ovens
Precision dispense equipment with positive displacement pump
Wave Solder
Automated BGA rework station
Certified IPC Trainer (CIT) on staff

IPC Certificate

Facilities Tour

Capabilites Overview.PDF

   



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