IC Die Packaging

Stacked & Multi Die Packaging

ISI is a project-oriented company, and is continually taking on challenging projects that utilize a wide variety of interconnect technologies.  Our specialties include:

	Multi die packaging (MCM, System in Package, SiP)
	Stacked die packaging
	Mixed assembly – combination of bare and packaged die
	Chip-on-board with laminate substrate
	Bare die assembly on flex circuits
	Bare die assembly on rigid flex circuits

Bare Die Assembly Capabilities

	IC Packaging
	Multi Die Packaging
	Advanced Packaging
	Stacked Die Packaging
	Optical Die Packaging
	Mixed Assembly- bare die with packaged devices

IC Packaging

ISI was founded to commercialize low cost, high performance organic IC packages as an alternative to ceramic packages.

Today ISI specializes in application specific IC packages with pin counts from 8 to 2000+. Our packages have been qualified by leading semiconductor companies including
Fairchild, Intel, Motorola, Philips, and Texas Instruments.

ISI has design and manufacturing capabilities for flip chip and wirebond packaging.

Many of our designs include an integrated heat spreader to accommodate
high wattage die.

ISI has designed over 150 packages for applications ranging from high performance, moderate volume to low cost, high volume. With our design tools and two decades of experience, we can turn a design for a new project in a few weeks.

Bare Die Capabilities
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